Die Bonder

Datacon 2200 EVO

Condition: excellent (used), Year of construction: 2017, functionality: fully functional, Datacon 2200 EVO (Gen3) The die bonder / multi-chip assembly machine from Datacon (Besi). Die attach, multi-chip, and flip-chip capabilities. Placement accuracy: ±10 µm at 3σ Theta: ±0.15° at 3σ Bond force: 0.5–75 N Up to 4 working heads Kjdpfey S S Uwox Acpenc Wafer handling up to 12 inches Die attach up to approximately 7,000 UPH/module Flip-chip up to 2,500 UPH with dipping Heated bond head up to 450 °C Substrate area up to 325 × 200 mm Weight approximately 1,300 kg

Condition: as good as new (ex-display), Year of construction: 2024, functionality: fully functional, Working area Grinding length: 250 mm Centre height: 100 mm Workpiece weight: 30 kg Z-axis: 350 mm Table adjustment: 8 ° degrees X-axis: 190 mm Grinding spindle Grinding wheel diameter max.: 500 mm Grinding wheel width max.: 80 mm Grinding wheel bore: 127 (203) Grinding wheel motor power: 5.5 kW Peripheral speed: 50 m/s Grinding wheel protection cover: D500 x 80mm Workpiece spindle Speed: 1 - 2,000 rpm Workpiece spindle mount: MK4 Tailstock Tailstock quill mount: MK3 Tailstock quill stroke length: 30 mm Cylinder fine adjustment range: ± 0.04 Equipment Paper belt filter system Rinse gun Mechanical fume extraction Kjdjvz Snkspfx Acponc

Year of construction: 2017, condition: excellent (used), Alicona InfiniteFocusXL200 G5 Measuring System Positioning Volume: 200 mm × 200 mm × 200 mm Maximum Workpiece Weight: 30 kg Objective Magnifications: 2.5x, 5x, 10xHX, 10x, 20xHX, 20x, 50x, 100x Numerical Aperture: 0.075–0.8 Working Distance: 4.5–37 mm Lateral Measuring Range: 5.63 mm to 0.16 mm Vertical Resolution: 2300 nm to 10 nm Measurement Noise: 800 nm to 1 nm Vertical Measuring Range: 8–36 mm Measuring Speed: up to 1.7 million measurement points/s Minimum Measurable Roughness Ra: 7 µm to 0.03 µm Minimum Measurable Roughness Sa: 3.5 µm to 0.015 µm Minimum Measurable Height: 2.3 µm to 0.01 µm Ksdpfx Acsx Dxw Tsponc Maximum Measurable Area: up to 40,000 mm² Flatness Accuracy: 0.1 µm (10x objective) No guarantee is given for the correctness, completeness, or up-to-dateness of the information.

Condition: used, Year of construction: 2006, Measurement range width/length/height: 1600/1800/1000 mm Knjdpfozn Iucox Acpec Dimensions width/length/height: 2450/2940/3800 mm Maximum workpiece weight: 3500 kg Measurement machine weight: 8500 kg Creep feed: 0 - 5 mm/s Setup operation: 0 - 70 mm/s Series measurement operation Axis: max. 300 mm/s Vector: max. 425 mm/s Software version: Calybso 2023/ Service Pack 2 – Version 7.6.08 Various measuring probes Measuring head

Condition: new, Year of construction: 2024, operating hours: 15 h, functionality: fully functional, type of input current: AC, input voltage: 240 V, measuring range X-axis: 580 mm, measuring range Y-axis: 300 mm, measuring range Z-axis: 200 mm, total width: 579 mm, total length: 916 mm, total height: 844 mm, overall weight: 45 kg, workpiece weight (max.): 50 kg, VL-770 3D measuring system with motorized rotary table Ø500mm - VL-770 measuring head - VL-700 control unit Knjdpfx Aevzqp Hjcpjc - 500mm object table VL-750 - Measuring range with composition up to Ø500mm or 580x300mm - Cover (light shielding) - Software package (German) - Calibration plate - Software module for form and positional tolerances - Software module for CAD conversion Full description available in the brochure

Year of construction: 2024, condition: as good as new (ex-display), functionality: fully functional, The JCM-7000 combines simple sample navigation with a range of advanced automatic functions. A large sample chamber, high resolution, and an optional low vacuum mode for non-conductive samples make this desktop SEM a versatile, mobile all-rounder. Features: • SE/BSE detection • Magnification up to x100,000, resolution approx. 8 nm • Low vacuum operation for non-conductive samples • Hardware and software integrated EDX system for elemental characterization • Live elemental analysis, live imaging (including 3D imaging/topography) • Intuitive operation with recipes, automatic functions, image montages, etc. • Large chamber for samples up to 80 mm diameter and 50 mm height • Compact & mobile • Dimensions (Main Unit): 324 mm W x 586 mm D x 566 mm H Knjdpfxezn Ih Ao Acpjc

Condition: used, Year of construction: 2010, grinding diameter 350 mm grinding length 1000 mm Knedpey U N Hiofx Acpsc centre height 175 mm Control Fanuc 310is CNC control GE Fanuc 310is Hand panel for CNC control GE Fanuc Wenger loader optional Turned part with automatic indexing 1° Grinding head UR 1-2-3 Grinding wheel equipment left 500 x 80 mm Grinding wheel equipment right 400 x 63 mm Operating unit for one high-speed internal grinding spindle MFV / MFZ High-frequency internal grinding spindle MFN 1090 Coolant supply through the workpiece spindle Dressing unit on the upper table Swivelling holder for PCD diamond plates Basic module for KEL-TOUCH gate sensor and KEL-BALANCE balancing devices KEL-TOUCH lead sensor for universal grinding head variants R / RS / UR / URS KEL-TOUCH on the workpiece headstock for internal and external grinding Preparations for Movomatic ESZ 400 or Marposs P7 ME measuring controls Preparation for external filters Cooling lubricant switch-off for table devices Full casing emulsion Emulsion sanding mist extraction system Maintenance unit for additional pneumatic functions Preparation for KEL-VITA gantry loader KEL-POS, MOVOMATIC: C25 measuring probe Hydraulic preparation for arobo bezel

Year of construction: 2025, condition: as good as new (ex-display), functionality: fully functional, Description (detailed specifications): o 5-axis stage Ksdpfxozn Ihps Acpenc o Modern, expandable user interface with EDX integration and image montage o SE detector o Scintillator-BSE detector o In-lens detector o Low-vacuum system with BSE detector o Fully software-integrated JEOL EDX system o In-column current measurement o Navigation camera o Live camera o Control panel o Desk, PC with Windows OS, 2 x 24" monitors, keyboard

Condition: excellent (used), Year of construction: 2017, functionality: fully functional, machine/vehicle number: 3379284, General Data Measurements width 1,650 mm Measurements depth 2,234 mm Measurements height 2,580mm Machine weight 3,600 kg Control System: Simens 840D solutionline Movement X-Axis Movement 700 mm Knjdpfsudy Huox Acpsc Y-Axis Movement 400 mm Z-Axis Movement 485 mm Workpiece Workpiece weight 400 kg Table Outer length 840 mm Outer width 420 mm IPG Laser 100W

Year of construction: 2012, operating hours: 63,311 h, condition: used, functionality: fully functional, machine/vehicle number: Y27639, Fitter fully functional Knedpsudk A Hefx Acpoc