Die bonding machine

Mühlbauer DS Variatio ECO W2W

2 identical machines available - both in great operational condition.

Spec as following:

1 OS Variation ecoLINE Wafer to Wafer incl. 6" Wafer expander 1x

1.2 Flip Chip unit for chip rotation (up side down) 1x

1.3 Standard Die set up 1x

1.4 Vision System Wafer Station 1x

1.5 Sidewall Inspection with visible light incl. Side-illumination for Wafer Camera 1x

1. 6 Vision System Die on Fly Station 1

1. 7 Vision System Pre/Post Place Station 1

1.8 Vision System - Wafer/Place/OOF camera+ CDA version 1x

1. 9 Vision Image storage 1 x

1.10 Output Station: Reconstructed Wafer Indexer 1x

1.11 Jedec Tray Adapter Plate for W2W Indexer Output Station 1x

1.12 Magazine for Jedec Tray Adapter 1x

1.13 High accuracy Mode 1x

1.14 Automatic Wafer Changer up to 12 inch (pull version) 1x

1.15 Wafer mapping HW & SW excl. Host PC 1x

1.16 Adjustable Die Ejector in X, Y 1x

1. 17 Preparation for FFU filter upgrade on machine TOP housing and Output wafer changer, Hepa filter will be

provided by COA 1x

1.18 Vision upgrade according to offer 20140746 1

1.19 Software Upgrade according to offer 20141342 1x
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1.20 2D Barcode Reader upgrade 1x

1.21 Label printer for reconstructed Wafer 1x

1.22 PalaMax Ready# incl. Palamax license 1x

Located within EU!