SMD reflow ovenEssemtec
RO 300
SMD reflow oven
Essemtec
RO 300
Year of construction
2005
Condition
Used
Location
Veenendaal 

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Machine data
- Machine type:
- SMD reflow oven
- Manufacturer:
- Essemtec
- Model:
- RO 300
- Year of construction:
- 2005
- Condition:
- good (used)
Price & Location
- Location:
- De Schutterij 15, 3905 PJ Veenendaal, Nederland

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Details about the offer
- Listing ID:
- A21298737
- Update:
- 23.02.2026
Description
Basic configuration
Oven type: Reflow soldering oven with full convection heating
Heating zones: 3 zones (convection)
Cooling zone: 1 zone (active air cooling)
PCB handling: Mesh belt or optional pin (chain) conveyor
PCB transport direction: Left → right
Dimensions (L × W × H): approx. 2000 × 710 × 1200 mm
Weight: approx. 237 kg
Controller: Microprocessor (LCD, languages incl. English/German/French)
Program capacity: 49 profiles (fixed + freely programmable)
Temperature setting: °C / °F
Temperature range: approx. 20°C – 300°C per zone
Max. reflow width: 10 – 300 mm
Conveyor speed: 100 – 800 mm/min (with optional slow-speed module)
Transport repeatability: ± 2 mm/min
Full convection air circulation:
Total heating air: 1200 m³/h
Per zone: 400 m³/h
Cooling zone: 300 m³/h
Atmosphere: air (standard), optional N₂ model available
Power requirement (EU): 3×400 VAC, 50 Hz, ~25 A
Power requirement (US): 3×208 VAC, 60 Hz
Continuous power: ± 6.1 kW
Start-up/warm-up power: ± 10 kW during initial warm-up
Min. exhaust: approx. 2×250 m³/h recommended
📊 Other details
Exhaust: 2 ports (80 mm), temperature < 55°C
Sound level: max. 70 dB(A)
Safety certifications: CE, EN954-1 Class 3
Features: emergency stop, overheat protection
✔ Reflow soldering of SMT printed circuit boards (Pb-free and standard)
✔ Continuous production and small to medium batch sizes
Gedpfoyl Uvvsx Af Toua
✔ Prototyping and R&D applications
✔ Optional air or nitrogen operation (depending on model)
The listing was translated automatically. Translation errors are possible.
Oven type: Reflow soldering oven with full convection heating
Heating zones: 3 zones (convection)
Cooling zone: 1 zone (active air cooling)
PCB handling: Mesh belt or optional pin (chain) conveyor
PCB transport direction: Left → right
Dimensions (L × W × H): approx. 2000 × 710 × 1200 mm
Weight: approx. 237 kg
Controller: Microprocessor (LCD, languages incl. English/German/French)
Program capacity: 49 profiles (fixed + freely programmable)
Temperature setting: °C / °F
Temperature range: approx. 20°C – 300°C per zone
Max. reflow width: 10 – 300 mm
Conveyor speed: 100 – 800 mm/min (with optional slow-speed module)
Transport repeatability: ± 2 mm/min
Full convection air circulation:
Total heating air: 1200 m³/h
Per zone: 400 m³/h
Cooling zone: 300 m³/h
Atmosphere: air (standard), optional N₂ model available
Power requirement (EU): 3×400 VAC, 50 Hz, ~25 A
Power requirement (US): 3×208 VAC, 60 Hz
Continuous power: ± 6.1 kW
Start-up/warm-up power: ± 10 kW during initial warm-up
Min. exhaust: approx. 2×250 m³/h recommended
📊 Other details
Exhaust: 2 ports (80 mm), temperature < 55°C
Sound level: max. 70 dB(A)
Safety certifications: CE, EN954-1 Class 3
Features: emergency stop, overheat protection
✔ Reflow soldering of SMT printed circuit boards (Pb-free and standard)
✔ Continuous production and small to medium batch sizes
Gedpfoyl Uvvsx Af Toua
✔ Prototyping and R&D applications
✔ Optional air or nitrogen operation (depending on model)
The listing was translated automatically. Translation errors are possible.
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Registered since: 2013
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