Connection System / Wafer Bonding SystemEVB
        520 IS    
 Connection System / Wafer Bonding System
EVB
        520 IS    
                        Bidding                    
                                            €115,000                                    
                Year of construction            
                2022            
            Condition        
            Used                    
            Location        
                                                Suhl                                            

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Machine data
- Machine type:
- Connection System / Wafer Bonding System
- Manufacturer:
- EVB
- Model:
- 520 IS
- Machine number:
- S220191
- Year of construction:
- 2022
- Condition:
- used
Price & Location
- Price:
- €115,000
- Auction start:
- 21.10.2025 at 11:00 o'clock
- Auction end:
- 26.11.2025 at 11:20 o'clock
- Location:
-             Am Mittelrain 11, 98529 Suhl                 
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Details about the offer
- Listing ID:
- A20356315
- Reference number:
- 376/4
- Update:
- 23.10.2025
Description
        Alignment system for wafers, max. wafer size 150 mm, max. wafer thickness 4.4 mm, manual loading and unloading, external cooling system by SMC, with process analysis recording, bonding module for UV light, bond cover for UV-LED curing, vacuum system with external vacuum pump and rack unit. NOTE: The equipment is as new and has not yet been used in production!
Rsdpexqih Nofx Ab Roch
The listing was translated automatically. Translation errors are possible.
Rsdpexqih Nofx Ab Roch
The listing was translated automatically. Translation errors are possible.
Seller
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