Automatic optical inspection

Mirtec MV-9DL

Year of construction: 2016, condition: used, Machine operational condition. Additional machines available from 2015 to 2016. Baseline specs as seen on pictures. Ask for additional details and quotation! Machine located within EU. Hfsdpfx Adsxy R Dqodeb

Year of construction: 2014, condition: good (used), Machine in operational condition with following specification: Dual-stage 2 x HM Head 2 x ScanCamera 2 x MultiCamera 2 x Nozzle Station 4 x FES32 Hfodpfsvfpmlsx Addsb Traceability package Ask for additional information!

Condition: good (used), Year of construction: 2015, functionality: fully functional, machine/vehicle number: Zeile 270, used inline automatic 3D X inspection system (AOI) for assembled PCBs. Defect types: misalignment, bent pins, etc. Multiple units are available, manufactured between 2013 and 2016. ----- Please indicate your offer price. Hfodpfx Aswzv Itjddeb Sale only within Europe (EU), including Turkey, United Kingdom, and Switzerland. ----- Technical specifications can be found in the handout. Without packaging; all warranty rights are excluded. If you intend to dismantle the equipment yourself, please mention this in your offer. We make no guarantees regarding the accuracy of technical data, completeness of accessories and tooling, or compliance with all safety and environmental protection requirements as outlined in accident prevention regulations.

Condition: ready for operation (used), Year of construction: 2015, Machine in operational condition. Located within EU. Hjdpfx Ajw E Eytoddsfb

Year of construction: 2009, condition: ready for operation (used), Connected load: 18kW, was overhauled in 2017, an inspection is possible. Hodpen Htktjfx Addjfb

Condition: excellent (used), Year of construction: 2018, Extremely fast and precise inspection for high-volume production Hsdpewkfuuefx Addsfb Z resolution 0.5 µm Z range Up to 30 mm (1.2") Angled view cameras Number of megapixel cameras 8 Orthogonal camera Resolution 10 µm Field of view 50mm x 50mm (2" x 2") Inspection speed Up to 65 cm2/s Software User interface Viscom vVision/EasyPro SPC Viscom SPC (statistical process control), open interface (optional) Verification station Viscom vVerify/HARAN Remote diagnosis Viscom SRC (software remote control) (optional) Programming station Viscom PST34 (optional) System computer Operating system Windows® Processor Intel® Core™ i7 PCB handling PCB dimensions 508 mm x 508 mm (20" x 20") Transport height 850 - 950 mm ± 20 mm (33.5" - 37.4" ± 0.8") Width adjustment Automatic Transport type Single track transport PCB clamping Pneumatic Upper transport clearance 50 mm (2") Lower transport clearance 45 mm (1.8"), up to 85 mm (3.3") optional; 40mm (1.6") with PCB support Other system data Positioning/handling unit Synchronous linear motors Interfaces SMEMA Power requirements 400 V (other voltages on request), 3P/N/PE, 8 A, 4 - 6 bar working pressure System dimensions 994 mm x 1565 mm x 1349 mm (39.1" x 61.6" x 53.1") (W x H x D) Weight 720 kg (1587 lbs

Year of construction: 2012, operating hours: 63,311 h, condition: used, functionality: fully functional, machine/vehicle number: Y27639, Fitter fully functional Hsdpfx Adeudk A Hjdjfb

Year of construction: 2016, condition: excellent (used), Automatic X-ray inspection For the inspection of BGA, QFN, THT, LED, LGA, and other solder joints, visible or hidden. Hfjdjwpuadepfx Addjb Other: Including offline station and repair station OS: Windows 7 Ultra-high speed line-scan CCD detectors Inspection area: 450 mm - 400 mm Image capture: 2D, 2.5D, 3D (layer images with planar CT) PCB dimensions: 60 - 450 x 50 - 400 mm AXI resolution: 6 - 30 µm / px AOI: Camera field of view: 42 mm x 42 mm Resolution: 21 µm Inspection height: -3 to 7.5 mm Optics: telecentric Transport height: 950 mm +/- 25 mm Interface: SMEMA Width adjustment: automatic

Condition: good (used), Year of construction: 2020, Inline reflow soldering under vacuum System was in operation until dismantling Available now; commissioning can be carried out by the manufacturer after consultation. Hjdpfxov Inw Ue Addofb Serial number: R036A-20D0012 Year of manufacture: 2020 Dimensions: 8,063 x 2,205 x 1,969 mm (L x W x H) Weight: Approx. 5,000 kg Rated power: 138 kW Continuous power during operation: approx. 14 - 25 kW Extraction capacity: 2 nozzles, 400 m³/h each Transport system: Working width: 100 - 630 mm, center support PCB length: 120 - 400/600 mm Process zone: Inlet 1,011 mm Heating zone with vacuum 4,600/4,750 mm Cooling zone 1,400 mm Outlet 730 mm Heating system: 4 cooling zones 11 heating zones, including: 9 convection heating modules Top/bottom preheating zone 2 convection heating modules top/bottom soldering zone Vacuum chamber: 400 mm Chamber volume: approx. 110 l / 150 l Pump power: up to 5.3 kW Ultimate pressure: up to 10 mbar

Year of construction: 2012, condition: ready for operation (used), An i-Pulse SMD placement machine with IQ Vision, a subsidiary of Yamaha, is available. PCB thickness range: 0.4mm-4.8mm, min. PCB dimensions X/Y: 50mm/30mm, max. PCB dimensions X/Y: 1480mm/510mm, transport speed: 900mm/s, number of heads: 4, production output: 24000CPH. Placement accuracy CHIP: +/-0.04mm, placement accuracy IC: +/-0.025mm, placement angle: +/-180°, max. component size range: 0402-120mm/90mm, max. component height: 30mm. Machine dimensions X/Y/Z: approx. 1750mm/1750mm/1450mm, weight: approx. 1500kg. Including 3x feeder carriages and 2x tray feeders for installation in the machine. Documentation available. On-site inspection is possible. Hjdpjwf Nywofx Addsfb